The Packaging Industry will address the World from Istanbul - Tüyap
Tüyap Fair and Congress Center has completed its preparations for the first hybrid meeting of the packaging industry. Eurasia Packaging Istanbul Fair, organized by Reed Tüyap Fair Organization in cooperation with Packaging Manufacturers Association with the support of numerous institutions steering the development of the sector, will welcome its visitors for the 26th time on October 20-23.
The fair, which will be held in hybrid format for the first time at Tüyap Fair and Congress Center in Istanbul this year, will offer exhibitors the opportunity to establish efficient business connections in a digital environment via the Business Connect Program, in addition to the physical fair. The industry, crowning its success in export in the first 6 months, will introduce its brand-new products, which are the outcome of R&D and innovation studies, to the countries of the World, from Istanbul - Tüyap.
Eurasia Packaging Istanbul Fair, which will be held at Tüyap Fair and Congress Center in Istanbul between the dates October 20th - 23rd, 2021 in cooperation with Reed Tüyap Fair Organization Inc. and Packaging Manufacturers Association (ASD) with the supports of Packaging Machinery Producers Association (AMD), Flexible Packaging Manufacturers Association (FASD), Label Manufacturers Association (ESD), Association of Cardboard Packaging Manufacturers (KASAD), Metal Packaging Manufacturers Association (MASD), Corrugated Cardboard Industrial Association (OMÜD) and Rigid Plastic Packaging Manufacturers Association (SEPA), will offer a hybrid fair experience to its visitors this year.
Click here for registeration.
