dublinbusiness wireresearch and markets httpwww.researchandmarkets.comresearchhvb9gfglobaland has announced the addition of the "global and chinese ic advanced packaging industry report, 20132014" report to their offering.&ldquoglobal and chinese ic advanced packaging industry report, 20132014&rdquoit is projected that in 2014 the output value of osat industry will grow by 8.4 to usd27.2 billion, and advanced packaging industry probably by 10 to usd18.2 billionat present, both mobile phones and computers are developing towards ultrathin, multicore and high frequency while memory industry is targeted at ultra bandwidth, which would prompt the packaging and testing market to satisfy the market demand with the updated technologies. since 2014, a number of new technologies have been applied, which would bring with it a more than 6 growth in packaging and testing industry. these technologies, including mlp pop, cu bol, fccsp, fowlp, embedded component trace substrate, and 2.5d, are mainly used in smartphones and ultrathin computers, with a robust market demand. meanwhile, tsv is expected to be widely applied from the memory industry. on the other hand, some major idm vendors like panasonic and renesas electronics have retreated from packaging business.in terms of industry, a type of middleend enterprises has emerged between foundry or idm and osat since 2008. in the era of fc packaging, these enterprises mainly provide rdl, wafer bumping, and wafer level test. but in the age of 2.5d and 3d, their scope of business has been greatly expanded, primarily including micro bumping, thin & reveal, interposer, via middle, wlcarrier assembly, etc.key topics coveredoverview of semiconductor industrystatus quo of memory and wafer foundry industryupstream market of semiconductor industrytrend in emerging advanced packaging technologiesanalysis and ranking of packaging enterprises23 major advanced packaging vendorscompanies mentionedaseamkorchipmoschipbondfatcgreatekhana micronjdevicesjectkyeclingsen precisionmpinantong fujitsu microelectronicsnepesptispilstats chippacsts semiconductorsigneticstian shui hua tian technologyutacunisemwalton advanced engineeringfor more information visit httpwww.researchandmarkets.comresearchhvb9gfglobaland contactsresearch and marketslaura wood, senior managerpress@researchandmarkets.comfor e.s.t office hours call 19173000470for u.s.can toll free call 18005268630for gmt office hours call 35314168900u.s. fax 6466071907fax outside u.s. 35314811716sector computing and technology, packaging 
