the program&rsquos focus is on intelligent pharmaceutical packages blisters. these help patients follow a course of medication by monitoring when a pill is taken out of its package. while some implementations already exist for smart blisters, they tend to be bulky and expensive to implement. the goal of the program is to develop a thin plastic foil, with an integrated ultralow power processor and radio, to replace the standard backing foil of a blister package. rolltoroll fabrication and lamination technologies will help achieve the low production costs needed for this type of application. for these developments, the program will draw heavily on the integration technologies for flexible systems technology program.
