Brewer Science, Inc. will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON Taiwan, an international event connecting supply chain partners across the semiconductor industry.
Dr. Alvin Lee, regional director at Brewer Science, has more than a decade of diverse experience in the semiconductor industry developing global partnerships to improve next-generation advanced packaging materials. Dr. Lee is a featured speaker at the SEMICON Taiwan Heterogeneous Integration Global Summit, which focuses on comprehensive high density and automotive heterogeneous integration.
His presentation, “New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging,” will address cost-effective solutions and innovative material technologies that enable advanced wafer-level packaging applications.
Materials will be discussed that address the growing challenges in applications requiring thin wafer handling, die attach, high-temperature processing, permanent adhesives, dielectrics, and wafer cleaning.
The presentation will address advanced materials that enable:
• Collective die-to-wafer hybrid bonding.
• Cu/polymer hybrid bonding.
• Advancement of temporary bonding/debonding technologies.
Brewer Science is also a sponsor of SEMICON Taiwan, providing a Platinum Sponsorship to the Heterogeneous Integration Global Summit. Additionally, Brewer Science is sponsoring the IC Forum and the Gala Dinner.