Ara Ohanian, Systech CEO, commented, "The embedding of Systech's e-fingerprint technology into Toppan's established offering delivers the promise of intelligent packaging on a massive global scale."
The collaboration allows Systech and Toppan to deliver innovative brand protection solutions that combat counterfeiting and prevent product diversion worldwide, they say. The combined offerings also help brands protect themselves from revenue erosion as a result of supply chain theft, and most importantly, protect consumers from potentially harmful products.
Takeshi Kabayama, head of Toppan's platform business center added, "We are proud to strengthen our partnership with Systech. Its unique, proven, non-additive brand safety solution harnesses existing product barcodes and packaging to create a unique signature that cannot be duplicated. Our combined expertise protects brand equity and provides consumer safety."
Major manufacturing brands are rapidly adopting existing technologies to fight the growing issue of product counterfeiting and diversion. However, many of these packaging elements are additive and costly. Global supply chain intrusion is on the rise and it is getting more difficult to track and trace real products with outdated technologies that can be replicated, according to the companies.
Companies are spending over $150 billion annually in additive anti-counterfeiting packaging, such as holograms, special seals and inks, watermarks and RFID tags - which can add cost and production changes while delivering marginal results, they claim. Systech's technology is non-additive and cost effective and can be implemented onto existing product and labelling production lines.