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Bhaskar Ch 20 February, 2018

February 2018. Tokyo-based Dai Nippon Printing Co., Ltd. (DNP) and SIG have signed a joint venture agreement which will bring new value added carton…

Bhaskar Ch 20 February, 2018

Düsseldorf (Germany), February 20, 2018 – The technology group GEA will exhibit its wide range of high-tech equipment and possibilities for…

Bhaskar Ch 19 February, 2018

Automation specialist appointed to OPC Foundation's Technical Advisory Council B&R is now represented in the OPC Foundation's Technical…

Bhaskar Ch 19 February, 2018

POWERLINK has been adopted by the IEEE under international standard IEEE 61158. It is the only Industrial Ethernet protocol to achieve this status.…

Bhaskar Ch 16 February, 2018

BEKUM BA series scores in terms of output and performance The BA series is a reference in water bottle production Berlin (Germany),…

Bhaskar Ch 15 February, 2018

Biocompatible PLA meets In-Mold Labelling (IML) Innovative IML-Concept: Beck Automation presents four-cavity IML machine for PLA coffee capsules…

Bhaskar Ch 15 February, 2018

Sharing of Latest Packaging Trend by Industry Experts at Sino-Pack 2018 The report by Mintel, a global marketing research firm, pointed out that,…

Bhaskar Ch 15 February, 2018

At the leading trade fair Anuga FoodTec in Cologne, Leybold presents its vacuum technologies for the food processing and packaging industry from the…

Bhaskar Ch 08 February, 2018

Dinkelsbuehl/Germany, February 2018 Intelligent Color (IC), software manufacturer from Dinkelsbuehl/Germany, presents »IC Split« a powerful tool…

Bhaskar Ch 07 February, 2018

EconCore’s continuous process for producing high performance lightweight thermoplastic honeycomb cores for composites is set to be a crowd-puller at…

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