Bostik’s proven, high-performance adhesives can be applied via a solvent or as a solvent-free laminating system. With modular systems built from resins and hardeners, the company has solutions for general, medium and high performance applications. These adhesives can be tailored to the most demanding applications, up to and including retortable laminations.
What is Dry Lamination?
Dry lamination is the process used to laminate two non-porous, or imperious to filtration, substrates. These include film-to-film or film-to-foil laminations. The adhesive used to bond the two together is first applied to one substrate then dried in an oven prior to being combined with the other. The substrates are then combined after the adhesive has dried.
Herberts™ Solventless Adhesives
Bostik’s one-and-two-component systems are designed for general purpose to high-performance dry laminations and can be used on high-speed laminators with excellent aesthetics.
Solventless Applications:
- Food and Medical Packaging: Bostik offers solventless systems that can run at high speeds and result in exceptional appearance when run with metalized films. They’re used to bond a variety of films to sealant layers, including those with high slip levels.
Herberts™ Solvent-Based Adhesives
Bostik’s polyester-based adhesives are applied out of ethyl acetate or acetone using a hardener. Specialty systems are also available in other common solvents like MEK, toluene or blends.
Solvent-Based Applications:
- Industrial: Bostik’s solvent-based applications are designed for the aggressive requirements of many specialized industrial applications where weatherability or high heat resistance is a challenge. Applications include backsheet laminations with 85°C/85% RH resistance greater than 2,500 hours.
- Food and Medical Packaging: Bostik’s one-and-two-component solvent-based systems can run at high speeds for general to high-performance laminations, making them ideal for a variety of food and medical packaging applications. They’re your best choice for adhesion to fluorinated films and applications requiring high temperature resistance. They excel on film-to-film laminations for retortable/sterilization packaging. Bostik also offers chemically resistant systems that can run on condiment packaging with low pH ingredients. The company’s solvent-based adhesives are used to bond a variety of films to sealant layers with varying slip levels. They’re expertly designed to provide excellent adhesion without impacting the packaged material.