Intel has reduced overall package size and enhanced cube efficiency for its line of processors by replacing all pvc inserts with thermoformed apet and corrugated fiberboard in a reduced package size for a substantial improvement in environmental impact for this highvolume product line. This responsible sourcing change achieved a reduction of 2.5 million pounds of material, reduced water consumption and reduced ghg emissions. This package reduction enabled a significant reduction in the number of vehicles required for transportation of raw materials and finished goods.
