dublinbusiness wireresearch and markets httpwww.researchandmarkets.comresearch9t4vhgequipmentand has announced the addition of the "equipment & materials for 3dic & waferlevel packaging applications " report to their offering.&ldquoequipment & materials for 3dic & waferlevel packaging applications&rdquothis report will present a comprehensive overview of the main equipment and materials used in the 3d & wlp applications. in addition, it includes insights on a number of equipment tools, breakdown by wafer size & revenue, by type of equipment & materials and advanced packaging applications. moreover, it also provides details about key suppliers, market share and technological highlights that impact the 3d & wlp industry.mainly supported today by flipchip wafer bumping, the equipment market generated revenue of more than 930m in 2013. it is expected that this equipment market revenue will peak at almost 2.5b. it is fueled by the 3d ic technology with tsv interconnects, an area offering opportunities for new developments in equipment modification equipment that is much more expensive than the tools used for established advanced packaging platforms 3d wlp, wlcsp, flipchip wafer bumping. indeed, 2015 will be the key turning point for the adoption of 3d tsv stacks since the memory manufacturers, such as samsung, sk hynix, micron, have already started to ship prototypes this year and might be ready to enter in highvolume manufacturing next year.in addition, logic manufacturers will diversify investments from systemonchip to packageonpackage and will benefit from advanced packaging platforms such as 2.5d interposer and fo wlp to stimulate their highvolume production.the materials market will grow from 789m in 2013 to over 2.1b with a cagr of 18. growth will mainly be driven by the expansion of the next generation waferlevelpackaging platforms 3d tsv stacked memories, multilayer rdl for fo wlp & wlcsp, which are becoming more complex and requiring additional and various thin layers, as well as advanced materials, to achieve better performance.the objectives of the report are toprovide market metrics both at equipment & materials levels from 2013 to 2019provide market share of the key equipment & materials suppliers involved in the packaging industrykey technical insight into future equipment & materials trends and challengesa forecast for the next five years, and to predict future trends for equipment & materials for 3d & wlp applicationsbetter understand process flows and technological trends in package manufacturingbetter understand equipment & materials industries for each process stepwhat&39s new update of market forecast from 2013 to 2019new analysis based on the competitive landscape and market share for all main equipment and materials suppliers for 3d tsv & wlp applicationsmore indepth analysis on the different equipment & materials technologies already available on the market and technology trendsupdate of 2013 key equipment & materials supplierskey technical insights and detailed analysis on equipment & materials solutions, trends, requirements and challengeskey topics covered1. report scope & definitions2. glossary3. companies cited in this report4. definitions, limitations & methodology5. analysis comparison 2011 vs. 20146. who should be interested in this report7. executive summary8. equipment market forecast for 3d & wlp9. 3dic & wlp technologies process flows & manufacturing trends analysis10. conclusions & perspectivesfor more information visit httpwww.researchandmarkets.comresearch9t4vhgequipmentand contactsresear… and marketslaura wood, senior managerpress@researchandmarkets.comfor e.s.t office hours call 19173000470for u.s.can toll free call 18005268630for gmt office hours call 35314168900u.s. fax 6466071907fax outside u.s. 35314811716
