US-based capital equipment company KLA has enhanced its systems portfolio for advanced packaging with the launch of new tools.
The new tools include the Kronos 1190 wafer-level packaging inspection system, the ICOS F160XP and the ICOS T3/T7 Series.
The systems will allow the customers to advance semiconductor device fabrication at the packaging stage. They will support the customers to overcome a broad range of integrated circuit (IC) challenges.