At the constituent meeting of the Advisory Board of interpack, the world's leading trade fair for processing & packaging, the Chairman and his two deputies were confirmed in their positions. The Advisory Board thus sends a clear signal of continuity and emphasises the importance of interpack's close ties with the packaging industry.
Effectively representing the interests of the industry and acting as a driving force for innovation and growth - that is the aim of interpack. The next edition will take place from 7 to 13 May 2026. On the way there, it will be actively supported by a 21-member trade fair advisory board made up of leading personalities from the packaging sector and the related process industry on the manufacturer and association side.
Markus Rustler, President and CEO of Theegarten-Pactec GmbH & Co. KG, was re-elected President and thus Chairman of the Board at the constituent meeting on 9 April 2024. Christian Traumann, Managing Director of the MULTIVAC Group and Roland Straßburger, CEO of SCHÜTZ GmbH & Co. KGaA were confirmed as Vice Presidents. All candidates were elected unanimously.
"I would like to thank you for the trust you have placed in me and look forward to continuing this task. Our common goal is to build on the success of interpack 2023 and to further strengthen the 2026 trade fair as a trend, technology and solution platform in order to proactively meet the opportunities presented by dynamic market changes," said Markus Rustler after his re-election.
"The personal dialogue with our partners from the companies and associations is of enormous value to us - especially in times of great challenges. We are very pleased about the extraordinary expertise and the trusting cooperation in our Advisory Board," said interpack Director Thomas Dohse at the end of the meeting.
The first meeting of the trade fair advisory board marks the start of the concrete content preparation phase for the next edition of interpack in May 2026. The world's most important suppliers of packaging machinery and processing technology, packaging materials and packaging aids, packaging production, finishing and packaging printing, marking and labelling technology as well as storage, logistics and transport technology are once again expected to exhibit. The main themes of the upcoming leading trade fair will be determined in the coming months.
The supplier trade fair "components" will once again be organised parallel to interpack at a central location in the exhibition centre.
